Product Name |
Gross die/8" |
N/P |
Process |
package |
BVdss (V) |
ID (A) |
Vth (V) |
Vgs (V) |
Rdson_10V (mΩ) |
Rdson_4.5V (mΩ) |
Wafer Thickness |
Backside Metal |
状态 |
||
Typ |
Max |
Typ |
Max |
||||||||||||
HL06N02 |
820 |
200VN |
SGT |
TO-220C |
200 |
129A |
3 |
±20 |
9.4 |
10.9 |
200um |
Ti-Ni-Ag |
量产 |
||
HL23N01 |
2047 |
150VN |
SGT |
TO-220/263/247 TOLL |
150 |
90 |
3 |
±20 |
8.2 |
10 |
200um |
Ti-Ni-Ag |
量产 |
||
HL22N01 |
1213 |
150VN |
SGT |
TO-220/263/247 TOLL |
150 |
132 |
3 |
±20 |
5.2 |
6.5 |
200um |
Ti-Ni-Ag |
量产 |
||
HL06N01 |
820 |
150VN |
SGT |
TO-220/263/247 TOLL |
150 |
200 |
3 |
±20 |
3.5 |
4.2 |
- |
- |
200um |
Ti-Ni-Ag |
量产 |
HL35N03(JB10018F) |
1803 |
100VN |
SGT |
TO-263 |
108 |
120A |
3 |
±20 |
3.4 |
4.25 |
200um |
Ti-Ni-Ag |
量产 |
||
HL47N02(JB11018F) |
1803 |
100VN |
SGT |
TO-263 |
115 |
120A |
3 |
±20 |
3.5 |
4.4 |
200um |
Ti-Ni-Ag |
量产 |
||
HL38N03(JB10015F) |
1520 |
100VN |
SGT |
TO-263 |
108 |
120A |
3 |
±20 |
3 |
3.75 |
200um |
Ti-Ni-Ag |
量产 |
||
HL70N02(JB11015F) |
1520 |
100VN |
SGT |
TO-263 |
115 |
120A |
3 |
±20 |
3.1 |
3.9 |
200um |
Ti-Ni-Ag |
量产 |
||
HL40N02（JB10011F） |
1096 |
100VN |
SGT |
TO-263 |
108 |
160 |
3 |
±20 |
2.3 |
2.9 |
200um |
Ti-Ni-Ag |
量产 |
||
HL72N02（JB11011F） |
1096 |
100VN |
SGT |
TO-263 |
115 |
160 |
3 |
±20 |
2.4 |
3 |
200um |
Ti-Ni-Ag |
量产 |
||
HL41N02（JB11009F） |
899 |
100VN |
SGT |
TO-263 |
115 |
180 |
3 |
±20 |
2.1 |
3.4 |
200um |
Ti-Ni-Ag |
量产 |
||
HL33N01 |
2845 |
100VN |
SGT |
TO-263/TO-220 |
103 |
120 |
3 |
±20 |
4.5 |
5.62 |
175um |
Ti-Ni-Ag |
量产 |
||
